IPC-BX7300
Robust, Fanless Box PC with Intel Socket-P CoreTM 2 Duo Platform
盒式工控機(jī)IPC-BX7300

Intel移動(dòng)平臺(tái)，極速性能
無風(fēng)扇設(shè)計(jì)
寬幅直流電源輸入
加固防震動(dòng)設(shè)計(jì)
豐富的載板I/O接口，PCI × 1
易安裝維護(hù)

系統(tǒng)
CPU Support Intel Socket-P (Penryn/ Merom) Core™ 2 Duo/
Celeron M with 667/800/1066MHz FSB
Memory 2 x 200-pin Dual Channels DDRII SO-DIMM
667/800MHz up to 4GB
Chipset Intel GM45 + ICH9M
Graphics Intel GM45 integrated GMA X4500, support DirectX 10,
Shader Model 4.0
ATA 1 x Serial ATA ports with 300MB/s HDD transfer rate
LAN Chipset 2 x Realtek RTL8111C 10/100/1000Base-T Gigabit
Ethernet
WatchdogTimer 1~255 level reset

輸入/輸出接口
Serial Port 1 x DB44 female connector
Support 4 x RS-232 ports
(COM4 is RS-232/422/485 selectable)
USB Port 8 x USB 2.0 ports
LAN 2 x RJ45 ports for GbE
Video Port 1 x DB15 female connector for Analog Output
1 x Display port
Selectable Port Either of DVI or Digital I/O or LPT
1 x DVI-D Female connector for Digital Video Output
1x 16-bit Digital I/O 8 in/8 out
SPP/EPP/ECP mode for FPT
TV-out 1 x 6-pin Mini-DIN connector supports S-Video directly
output or Composite output via extrenal cable
Audio
Expansion Bus 1 x PCI slot w/ riser card
1 x Mini-card slot
Mic-in/Line-out (6W pre-amplified)

環(huán)境
Operating Temp. -20 ~ 55°C (-4 ~ 131°F), ambient w/ air flow
Storage Temp.
-40 ~ 85°C (-40 ~ 185°F)
Relative Humidity 10 ~ 95% @ 40°C (non-condensing)
Vibration MIL-STD-810F, Method 514.5, Procedure 1, Category 4
Shock & Crash Operating 20G (11ms), Non-operating 40G with HDD
Operating 40G (11ms), Non-Operationg 60G with CF/SSD
Crash 80G (11ms)

認(rèn)證
CertificationCE, FCC

電源
Power input DC 10V~28V input (w/ 4-pin DC input terminal block
combine remote power on/off switch)
Power Consumption 60W (Max.)

存儲(chǔ)
Type 1 x 2.5" Drive bay for HDD /SDD
1 x CompactFlash Type II socket which can be
outside accessible

結(jié)構(gòu)
Construction Aluminum alloy
Mounting Support wall-mounting
Weight 3.9 kg (8.6 lb)
Dimensions (Wx D x H) 195 x 268 x 80 mm (7.68" x 10.55" x 3.15")